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C-EP 4727-1R Technical Data Sheet
ONE COMPONENT EPOXY SURFACE MOUNT ADHESIVE
单组分环氧树脂贴片胶
PRODUCT DESCRIPTION 产品介绍
C-EP 4727-1R surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by Stencil Print Method. It has following features. C-EP 4727-1R贴片胶用于模板印刷法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.
-
A range of dot height with single stencil thickness obtainable 可获得单模板厚度的点高度排列
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Excellent green/wet strength 极佳的未固化/湿强度
-
High speed printing 高速印刷
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
|
Property 性能 |
Test Method 测试方法 |
C-EP 4727-1R |
|
Color/Appearance 颜色/外观 |
Visual |
Viscous Red paste 粘稠红色浆糊 |
|
Specific Gravity 密度, g/cc, |
ASTM D-792 |
1.3 |
|
Viscosity 粘度, cone & Plate, Pa.s |
ASTM D-2393 |
200-450 (25°C) |
|
Yield strength 屈服强度, cone & Plate, Pa, 25°C |
|
400-600 |
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
|
Property 性能 |
Test Method 测试方法 |
Value 数值 |
|
Coefficient of thermal expansion 热膨胀系数, CTE |
ASTM D696 |
85 E-06 |
|
Thermal conductivity 导热率, w/m-k |
ASTM C177 |
0.25 |
|
Glass transition temperature 玻璃化转变温度, Tg, °C |
ASTM D4065 |
135 |
|
Lap shear strength, steel 搭接剪切强度, Mpa |
|
20 |
|
Torque strength 扭转强度, FR4 PCB, N.mm |
|
55 |
|
Pull off strength 拉离强度, FR4 PCB, N |
|
50 |
|
Volume resistivity 体电阻系数, ohms-cm |
ASTM D-257 |
5 E+15 |
|
Surface resistivity 表面电阻系数, ohms |
ASTM D-257 |
30 E+15 |
|
Dielectric constant 电介质常数 |
ASTM D150 |
2.8(1 kHz), 2.7(10 kHz) |
|
Hot solder dip @ 260°C 热浸焊@ 260°C |
|
Pass |
|
Humidity 98%RH / 40°C, 1000 hours, strength retention 相对湿度98%/40°C下1000小时后的强度保持 |
|
80% |
DIRECTIONS FOR USE 使用方法
Typical curing condition 典型固化条件: 90 ~ 120 seconds at 150 ºC 在150 ºC下保持90 ~ 120 秒
Curing starts above 100 ºC, with a DSC conversion of 90%, 2 min. at 125 ºC, 10 min. at 100 ºC 固化开始于100 ºC以上, 在125 ºC保温2分钟, 在100 ºC保温10分钟, 热转换为90%.
CLEANING 清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除
STORAGE INFORMATION 保存方法
在5 ºC下密封干燥储存, 保质期为6个月
