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C-EP 4619 Technical Data Sheet
Single component epoxy adhesive单组分环氧树脂粘接剂
PRODUCT DESCRIPTION 产品介绍
C-EP 4619 is a One-component CSP/BGA corner bond fill material. It can be cured during lead-free solder reflow while allowing self-alignment of IC components. The material can be pre-applied to the board at the corners of the CSP pad site using a Standard SMA dispenser. When heat cured, it improves mechanical reliability of hand-held Devices. The material is reworkable. C-EP 4619是一种单组分CSP/BGA转角粘接填充材料,它在无铅回流焊接中固化的同时还能自动准直IC元件。使用标准的SMA(表面安装粘接剂,贴片胶)分散方式,该材料可以预先施加到电路板上的CSP衬垫处的转角位置。加热固化后,该材料可提高手持设备的机械可靠性。C-EP 4619具可返修性。
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能 |
Test Method 测试方法 |
C-EP 4619 |
Color/Appearance 颜色/外观 |
Visual |
Liquid, Black 黑色液体 |
Specific Gravity 比重 |
ASTM D-792 |
1. 23 |
Viscosity 粘度@ 25°C, cps |
ASTM D-2393 |
50,000 |
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Material cured at 180°Cx3 hours 材料在180°C下固化3小时
Property 性能 |
Test Method 测试方法 |
Value 数值 |
Hardness 硬度(Shore D) |
ASTM D-2240 |
70 |
Flow rate, room temperature |
|
Good dispense capability |
Glass transition temperature 玻璃化转变温度, Tg, ºC |
|
120 |
Coefficient of thermal expansion 热膨胀系数CTE, ppm |
ASTM D3386 |
57/180 |
Strain at yield |
|
2.5 % |
Flexual modulus 模量, N/mm2 |
|
2100 |
Tensile Strength, MPa |
ASTM D790 |
55 |
Volume resistivity 体电阻系数, ohms-cm |
ASTM D-257 |
4.3 E+16 |
Surface resistivity 表面电阻, ohms |
ASTM D-257 |
8.4 E+16 |
Dielectric constant |
ASTM D150 |
3.5 (10 MHz) |
DIRECTIONS FOR USE使用指南
Resin/Hardener Ratio (by weight) 树脂/固化剂(重量比) one component 单组分
Resin/Hardener Ratio (by volume) 树脂/固化剂(体积比) one component 单组分
Pot Life, 25°C 使用期 3 months 3月
CURING SCHEDULE 固化进度表:
Lead-free reflow with 245°C . 在245°C下无铅回流。
STORAGE INFORMATION 贮存方法
Store at 2 ºC to 8 ºC in a unopened can and dry condition. Shelf life is 6 months. 2 ºC到8 ºC 于干燥环境中密封保存, 保质期为6个月。