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C-EP4148 Technical Data Sheet Single component epoxy adhesive单组分环氧树脂粘接剂
PRODUCT DESCRIPTION 产品介绍
C-EP 4148 is a one component, quickly heat cure, reworkable CSP/BGA underfill. The material cures at low temperature. The cured material shows excellent protection for a variety of mechanical stress, including shock, drop and vibration etc.
C-EP 41488是一种单组分,热固化,可返修的CSP/BGA底部填充胶。该材料可快速低温固化。在固化后该材料可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能 |
Test Method 测试方法 |
C-EP 4148 |
Color/Appearance 颜色/外观 |
Visual |
Black liquid透明清澈液体 |
Viscosity 粘度@ 25°C, cps |
Brookfield CP 52/10 |
1,900-2600 |
Shelf life 保质期@ 5 °C, month 月 |
|
6 |
Pot life @22°C,days天 |
|
10 |
Density@22°C, g/ml密度 |
|
1.12 |
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Material cured at 100°Cx60 minutes 材料在100°C下固化60分钟
Property |
Test Method |
Value |
Lap shear strength剪切强度, N/mm2 |
|
10.3 |
Tensile elongation延伸率, % |
ASTM D882 |
2.6 |
Glass transition temperature玻璃化转变温度, Tg °C |
|
25 by TMA |
Coefficient of thermal expansion热膨胀系数, CTE, ppm |
|
35 / 118 |
Storage modulus储能模量, 25°C, GPa |
|
2.2 |
Flexural modulus弯曲模量, 25°C, GPa |
|
3.3 |
CURING SCHEDULE 固化进度表:
25 minutes at 120 C or 25 minutes at 120 C. 100°C下30分钟或者150°C下5分钟。
STORAGE INFORMATION 贮存方法
Store at 2 - 8 °C in a dry, cool place and in sealed containers out of direct sunlight. 2 - 8 °C于干燥环境中密封保存, 防止阳光直射,保质期为6个月。
Notes: it is the user’s responsibility to determine the suitability of the products and methods of use.