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C-EP 522 is a single component, heat curable, electrically conductive, modified thermoplastic which is designed for display application on ITO film. It can dry at low temperature. Its typical assembly applications include Touch panels, Electroluminescent lamps, Flexible circuits and ITO coated film on Polyester film, ITO coated substrates, Paper, Cardboard and Polyimide film. C-EP 522是一款单组分的较低温度热固化改性热塑性塑料,它被设计用于触摸面板,电致发光灯具,柔性线路,ITO导电膜等,可应用基质包括聚酯薄膜,ITO覆膜基质, 纸质,卡纸板,聚酰亚胺薄膜。C-EP 522具有以下优势:
Low electrical resistance低电阻
Conductive电传导
Extremely flexible极佳的柔韧性
Excellent adhesion极好的粘附性
Screen printable可整版印刷
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties性能 |
C-EP 522 |
Color/Appearance 颜色/外观 |
Silver银色 |
Specific Gravity比重, g/cm3比重 |
2.10 |
Viscosity @ 25°C, speed 20 rpm cps 粘度(25°C) |
20,000-34,000 |
Theoretical coverage, m²/kg理论覆盖面积: @ 10μm dry coating thickness |
15 |
Shelf Life 储存期@ 5 to 30ºC , months: From date of qualification in original seal |
6 |
Flash Point闪点 , ºC |
104 |
TYPICAL PROPERTIES 典型属性
Recommended Thickness推荐干膜厚度 Applied dry coating thickness , μm |
8-13 |
Emulsion Thickness乳剂厚度, μm |
20-38 |
Recommended Screen Type推荐版面印刷类型 |
Monofilament polyester or equivalent单丝metal screen 61 to 90 threads/cm聚酯或对等的金属面网, 61-90线/厘米 |
Recommended Squeegee推荐刮墨刀 Polyurethane聚氨酯 , durometer硬度 |
60-74 |
Printing Equipment Type印刷设备类型 |
Manual手动 Semi-automatic半自动 High speed高速 |
Cured adhesion , grade固化后粘附等级 |
5B |
Cured Sheet Resistivity固化后表面电阻率@ 25μm, ohms/sq |
<0.03 |
CURING TIME TABLE 固化进度表
Temperature 温度 |
Minimum Cure Time 最少固化时间 |
120°C |
15 minutes @ |
C-EP 522 can be dried immediately after printing at temperatures between 90 to 40ºC. Higher temperatures will yield lower sheet resistance and better mechanical properties. C-EP 522可在90到140 ºC下迅速表干,高的温度将导致更低的表面电阻率和更好的机械性能
DIRECTIONS FOR USE使用指南
1. thoroughly stirr prior to use. Avoid rapid stirring as this causes air entrapment.使用前充分搅拌,避免剧烈搅拌引入气泡。
2. C-EP 522 is supplied ready for use. Should thinning become necessary, dilute 1 to 3% by weight withdibasic ester. 如有必要,请用二元酯稀释到1-3%的重量比。