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C-EP 4911 Technical Data Sheet
Single component epoxy adhesive单组分环氧树脂粘接剂
PRODUCT DESCRIPTION 产品介绍
C-EP 4911 is a one component, reworkable CSP/BGA underfill. It has fast flow at room temperature without pre-heating the substrates. When heated, it cures quickly at medium temperature to minimize thermal stress to other components on the PCB. The cured material provides excellent protection for solder joints against mechanical and thermal stress such as shock, drop, and vibration in hand-held devices. C-EP 4911是一种单组分,可返修的CSP/BGA底部填充胶。该材料在不需要衬底加热的情况下于室温即具有快的流动速率。C-EP 4911加热后在中等温度下即可固化以减少与PCB上的其它元件的热应力。该材料在固化后可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能 |
Test Method 测试方法 |
C-EP 4911 |
Color/Appearance 颜色/外观 |
Visual |
Liquid, Black 黑色液体 |
Specific Gravity 比重 |
ASTM D-792 |
1. 1 |
Viscosity 粘度@ 25°C, cps |
ASTM D-2393 |
250 |
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Material cured at 130°Cx10 minutes 材料在130°C下固化10分钟
Property 性能 |
Test Method 测试方法 |
Value 数值 |
Hardness 硬度(Shore D) |
ASTM D-2240 |
80 |
Flow rate, room temperature, seconds |
|
75-90 |
Glass transition temperature 玻璃化转变温度, Tg, ºC |
|
127 |
Coefficient of thermal expansion 热膨胀系数CTE, ppm |
ASTM D3386 |
62/130 |
Flexural strength 弯曲强度, Mpa |
ASTM D-790 |
120 |
Modulus 模量, N/mm2 |
|
2850 |
Thermal cycling, Up to 1600 cycles |
-55 ºC ~ 125 ºC |
No failure |
Thermal/humidity bias test, Up to 500 hours |
|
No loss in resistance |
Volume resistivity 体电阻系数, ohms-cm |
ASTM D-257 |
4.0 E+16 |
Surface resistivity 表面电阻, ohms |
ASTM D-257 |
8.0 E+16 |
Dielectric constant |
ASTM D150 |
3.55 (10 MHz) |
DIRECTIONS FOR USE使用指南
Resin/Hardener Ratio (by weight) 树脂/固化剂(重量比) one component 单组分
Resin/Hardener Ratio (by volume) 树脂/固化剂(体积比) one component 单组分
Pot Life, 25°C 使用期 2-3 days 2-3天
CURING SCHEDULE 固化进度表:
6-10 minutes at 130 ºC. 130 ºC 下6-10分钟。
STORAGE INFORMATION 贮存方法
Store at -15 ºC to - 20 ºC in a unopened can and dry condition. Shelf life is 6 months. -15 ºC到-20 ºC 于干燥环境中密封保存, 保质期为6个月。