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4647
    发布时间: 2018-09-11 10:39    

C-EP4647            Technical Data Sheet Single component epoxy adhesive单组分环氧树脂粘接剂

 

 

 

 

PRODUCT DESCRIPTION 产品介绍

C-EP 4647 is a one component, low viscosity, reworkable CSP/BGA underfill. The material cures at low temperature.  The cured material shows excellent protection  for  a variety of mechanical stress, including shock, drop and vibration etc.

C-EP 4647是一种单组分,低粘度,可返修的CSP/BGA底部填充胶。该材料可低温固化。在固化后该材料可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。

 

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

Properties 性能

Test Method 测试方法

C-EP 4647

Color/Appearance 颜色/外观

Visual

Transparent, clear liquid透明清澈液体

Specific Gravity

ASTM D-792

1.15

Viscosity 粘度@  25°C, cps

  Brookfield CP 52/10

400-450

Shelf life 保质期@ 5 °C, month 

 

6

 

 

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能

Material cured at  120°Cx6 minutes 材料在120°C下固化6分钟

Property

Test Method  

Value                   

Tensile strength拉伸强度, N/mm2

ASTM D882

 100

Tensile elongation延伸率, %

ASTM D882

3.9

Glass transition temperature玻璃化转变温度, Tg  °C

 

129 by TMA

Coefficient of thermal expansion热膨胀系数, CTE, ppm

 

75 / 198

Storage modulus储能模量, 25°C, GPa

 

2.2

Flexural  modulus弯曲模量, 25°C, GPa

 

3.2

 

CURING SCHEDULE 固化进度表:

15 minutes at 120 C or 2 minutes at 130 C. 120°C15分钟或者130°C2分钟。

STORAGE INFORMATION 贮存方法

Store at 2 - 8 °C in a dry, cool place and in sealed containers out of direct sunlight. 2 - 8 °C于干燥环境中密封保存, 防止阳光直射,保质期为6个月。

 

Notes:  it is the user’s responsibility to determine the suitability of the products and methods of use.