C-EP4628            Technical Data Sheet Single component epoxy adhesive单组分环氧树脂粘接剂

PRODUCT DESCRIPTION 产品介绍

C-EP 4628 is a one component, heat cure, reworkable CSP/BGA underfill. The material cures at low temperature.  The cured material shows excellent protection  for  a variety of mechanical stress, including shock, drop and vibration etc.

C-EP 4628是一种单组分，热固化，可返修的CSP/BGA底部填充胶。该材料可低温固化。在固化后该材料可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护.

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

RECOMMENDED CURING CONDITIONS推荐固化条件

5 minutes @ 150 °C          150°C下5分钟

10 minutes @ 130 °C        130°C下10分钟

Note: the time required for cure depends on the rate of heating in all fast cure systems, Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Conditions where a hot plate or heat sink is used are optimum for fastest cure. We recommend using the recommended curing conditions. 注:在所有的快速固化系统中，需要的固化时间取决于加热速率。当使用热板或散热片的条件下能达到最佳的最快的固化效果。固化速度取决于材料的质量与加热热源的接触程度。我们建议使用推荐的固化条件。

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能

Material cured at  100°Cx60 minutes 材料在100°C下固化60分钟

GENERAL INFORMATION一般资料

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). 有关本产品的安全注意事项，咨询材料安全数据表（MSDS）。

Handling Information储运注意事项

1. Refrigerated transport冷藏运输

All shipping boxes are packed with cold gel packs to maintain temperature below 8 °C during transit. 所有的运输箱里都填充满冷凝胶包以保证在运输过程中保持温度低于8°C.

2. Temperature Equilibration温度平衡

Under ambient conditions, a new packed product can be allowed to place at room temperature (22 ± 2 ° C) for 1 to 2 hours (the actual time required will vary with the package size / volume change). Do not release the lid of the container, the cap or cover ,syringe packs must be allowed to equilibrate in tip down orientation. Heat Must never be used as partial polymerization (curing) could occur. 室温条件下，一个新包装好的产品可以允许放置在室温下（22±2℃），为1〜2小时（实际所需的时间将随封装尺寸/体积的变化而变化）。不要松开容器的盖子，帽或罩：注射器包必须让尖向下的方向中平衡。绝不能用来加热否则可能发生部分聚合（固化）.

Usage使用方法

Product into dispensing equipment. The various dispensing equipment are applicable, including: manual dispensing / timing pressure valve, the screw-type valve, linear piston pump, and the jet valve. Equipment selection should depend on the application requirements, equipment selection and process optimization suggestions, users should contact the Technical Service Center. 将产品放入点胶设备。各种不同的点胶设备都是适用的，其中包括：手工点胶/定时压力阀，螺旋式阀门，线性活塞泵和射流阀。设备选型应取决于应用的需求 ，在设备选型和工艺优化方面的建议，用户应联系相关的技术服务中心.

1. To ensure that the air in the running of the equipment does not introduce products. 确保空气在设备运行时不引入产品中

2. For best results, the substrate should be preheated  (typically to 40 °C for about 20 seconds) to allow fast capillary flow and facilitate leveling 为了获得最佳结果,应预热基板（通常为40℃下进行约20秒）,以允许最快速的毛细流动和便于流平.

3. The product distribution at medium speed (2.5 to 12.7 mm / sec), to ensure that the needle tip of about 0.025 to 0.076 mm from substrate surface and from chip edge , which will ensure optimum flow conditions for the underfill. 以中等速度（2.5至12.7毫米/秒）配送产品,确保针尖约0.025到0.076毫米的基板表面和芯片边缘,这将确保最佳的流动条件下的底部填充.

4. Dispensing mode is usually along the "I" on one side or along the "L" mode on both sides, focused on the corner. The dispensing program should start from the furthest away from the location of the center of the chip - which helps ensure void-free fill below the mold.. Each leg of the "L" or "I" pattern should not exceed 80 % of the length of each die edge being dispensed 点胶模式通常是沿"I"一侧或沿"L"模式两侧，集中在角落里。点胶程序应该从最远的远离芯片中心位置开始 - 这有助于确保无空隙的填充下面的模具。"L"或"I"的模式下，每个桥臂不应该超过模具边缘长度的80％.

For Rework返修说明

1. Removal of CSP from PCB 从PCB上去除CSP

Any molten solder instrument are suitable for removing the CSP in this step. When reach a sufficiently high temperature, touch the fillet of underfill around the CSP using a scraper to see if it is softened. to see whether it is being softened. If the fillet is sufficiently soft t, remove it. When bondline reaches temperature above melting point of solder, indicated by molten solder blowing out between CSP & PCB, . 任意能够熔融焊料的仪器都是适合用于除去在此步骤中的CSP。当达到足够高的温度时，用刮刀触摸周围的底部填充料的圆角的CSP，看它是否被软化。如果圆角足够软，取出圆角。当胶层达到焊料的熔点温度以上，熔融焊料从CSP和PCB之间吹出来，用刮刀将CSP从PCB移除。
 2. Removing Underfill Residue移除底部填充胶残留物

After removing the CSP, scrape away underfill and solder residues on the surface of the PCB using the Soldering Iron.  Typically recommendation of iron top temperature is 250 to 300 °C (setting temperature). Scraping of residue should be carefully executed to avoid damaging resist and pads on PCB. 除去CSP之后，用烙铁刮去底部填充料和残留在PCB表面的焊剂。通常，建议的铬铁最高温度为250〜300℃（设定温度）。去除残留物应认真执行，用垫片垫在PCB上以避免损坏。
3. Clean Up清理

With a clean, dry cotton swab moistened with an appropriate solvent wipe the surface. Repeat this step用干净的干棉签用沾适当的溶剂，擦拭表面。重复此步骤。

Do Not return product to refrigerated storage; any surplus　product should be discarded产品不返回冷藏储存有任何盈余的产品应该丢弃

Storage储存

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. 未开封的产品容器贮存于在干燥的地方。存储的信息在产品外包装的标签上注明。

Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. 理想贮存条件：2°C至8°C。存储低于2°C或高于8°C可能会影响产品性能

Material removed from containers may be contaminated during use. Do not return product to the original container.  If you need additional information, please contact your local Technical Service Center or Customer Service Representative. 取出的材料在使用过程中可能被污染。所以产品不要倒回原来的容器中。如果需要额外的信息，请联系您当地的技术服务中心或客户服务代表。

Note声明

The data contained herein are for reference only, are reliable. zhbond Company can help users determine the best  appropriate use of this product, to determine the best appropriate production methods and mentioned herein preventive measures, we recommend each future users repeat testing should be carried out before using it and  using this test data as a guide . 本文中所含的数据仅供参考，都是可靠的。正邦公司可帮助用户确定本产品的最适合用途，确定最适合的生产方法以及本文提到的相关预防措施等，我们建议每个未来的用户使用前都要进行重复测试并使用此测试数据作为指导。

Notes:  it is the user’s responsibility to determine the suitability of the products and methods of use.