C-EP 4619is a One-component CSP/BGA corner bond fill material. It can be cured during lead-free solder reflow while allowing self-alignment of IC components. The material can be pre-applied to the board at the corners of the CSP pad site using a Standard SMA dispenser.When heat cured, it improves mechanical reliability of hand-held Devices. The material is reworkable. C-EP 4619是一种单组分CSP/BGA转角粘接填充材料，它在无铅回流焊接中固化的同时还能自动准直IC元件。使用标准的SMA（表面安装粘接剂，贴片胶）分散方式，该材料可以预先施加到电路板上的CSP衬垫处的转角位置。加热固化后，该材料可提高手持设备的机械可靠性。C-EP 4619具可返修性。
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能
Test Method 测试方法
C-EP 4619
Color/Appearance 颜色/外观
Visual
Liquid, Black 黑色液体
Specific Gravity 比重
ASTM D-792
1. 23
Viscosity 粘度@ 25°C, cps
ASTM D-2393
50,000
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Material cured at 180°Cx3hours 材料在180°C下固化3小时
Property 性能
Test Method 测试方法
Value 数值
Hardness 硬度(Shore D)
ASTM D-2240
70
Flow rate, room temperature
Good dispense capability
Glass transition temperature 玻璃化转变温度, Tg, ºC
120
Coefficient of thermal expansion 热膨胀系数CTE, ppm
ASTM D3386
57/180
Strain at yield
2.5 %
Flexual modulus 模量, N/mm2
2100
Tensile Strength, MPa
ASTM D790
55
Volume resistivity 体电阻系数, ohms-cm
ASTM D-257
4.3 E+16
Surface resistivity 表面电阻, ohms
ASTM D-257
8.4 E+16
Dielectric constant
ASTM D150
3.5 (10 MHz)
DIRECTIONS FOR USE使用指南
Resin/Hardener Ratio (by weight)树脂/固化剂（重量比）one component单组分
Resin/Hardener Ratio (by volume)树脂/固化剂（体积比）one component单组分
Pot Life, 25°C使用期3 months3月
CURING SCHEDULE 固化进度表:
Lead-free reflow with 245°C.在245°C下无铅回流。
STORAGE INFORMATION 贮存方法
Store at 2 ºC to 8 ºC in a unopened can and dry condition. Shelf life is 6 months. 2 ºC到8 ºC 于干燥环境中密封保存, 保质期为6个月。
