C-EP4 148 Technical Data Sheet Single component epoxy adhesive 单组分环氧树脂粘接剂
PRODUCT DESCRIPTION 产品介绍
C-EP 4 148 is a one component, quickly heat cure , reworkable CSP/BGA underfill. The material cures at low temperature. The cured material shows excellent protection for a variety of mechanical stress, including shock, drop and vibration etc.
C-EP 4 1488 是一种单组分， 热固化 ，可返修的 CSP/BGA 底部填充胶。该材料可 快速 低温固化。在固化后该材料可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Properties 性能
Test Method 测试方法
C-EP 4 148
Color/Appearance 颜色 / 外观
Visual
B lack liquid 透明清澈液体
Viscosity 粘度 @ 25°C, cps
Brookfield CP 52/10
1,9 00- 2600
Shelf life 保质期 @ 5 °C, month 月
6
P ot life @22 °C ,days天
10
D ensity @22 °C , g/ml 密度
1.12
TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Material cured at 1 0 0°Cx 6 0 minutes 材料在 1 0 0°C 下固化 6 0 分钟
Property
Test Method
Value
L ap shear strength 剪切 强度 , N/mm2
10.3
Tensile elongation 延伸率 , %
ASTM D882
2.6
Glass transition temperature 玻璃化转变温度 , Tg °C
25 by TMA
Coefficient of thermal expansion 热膨胀系数 , CTE, ppm
35 / 118
Storage modulus 储能模量 , 25°C, GPa
2.2
Flexural modulus 弯曲模量 , 25°C, GPa
3. 3
CURING SCHEDULE 固化进度表 :
25 minutes at 1 2 0 C or 25 minutes at 1 2 0 C . 1 0 0 °C 下 30 分钟或者 1 5 0 °C 下 5 分钟。
STORAGE INFORMATION 贮存方法
Store at 2 - 8 °C in a dry, cool place and in sealed containers out of direct sunlight. 2 - 8 °C 于干燥环境中密封保存 , 防止阳光直射，保质期为 6 个月。
Notes: it is the user’s responsibility to determine the suitability of the products and methods of use.
