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522
    发布时间: 2018-09-10 23:56    

C-EP 522                     Technical Data Sheet

 

PRODUCT DESCRIPTION 产品描述

C-EP 522 is a single component, heat curable, electrically conductive, modified thermoplastic which is designed for display application on ITO film. It can dry at low temperature. Its typical assembly applications include Touch panels, Electroluminescent lamps, Flexible circuits and ITO coated film on Polyester film, ITO coated substrates, Paper, Cardboard and Polyimide film. C-EP 522是一款单组分的较低温度热固化改性热塑性塑料,它被设计用于触摸面板,电致发光灯具,柔性线路,ITO导电膜等,可应用基质包括聚酯薄膜,ITO覆膜基质, 纸质,卡纸板,聚酰亚胺薄膜。C-EP 522具有以下优势:

  • Low electrical resistance低电阻

  • Conductive电传导

  • Extremely flexible极佳的柔韧性

  • Excellent adhesion极好的粘附性

  • Screen printable可整版印刷

     

    PROPERTIES OF UNCURED MATERIAL 固化前材料性能

Properties性能

C-EP 522

Color/Appearance 颜色/外观

Silver银色

Specific Gravity比重, g/cm3比重

2.10

Viscosity @ 25°C, speed 20 rpm cps 粘度(25°C

20,000-34,000

Theoretical coverage, m²/kg理论覆盖面积:

@ 10μm dry coating thickness

15

Shelf Life 储存期@ 5 to 30ºC , months:

From date of qualification in original seal

6

Flash Point闪点 , ºC

104

 

TYPICAL PROPERTIES 典型属性

Recommended Thickness推荐干膜厚度

Applied dry coating thickness , μm

8-13

Emulsion Thickness乳剂厚度, μm

20-38

Recommended Screen Type推荐版面印刷类型

Monofilament polyester or equivalent单丝metal screen 61 to 90 threads/cm聚酯或对等的金属面网, 61-90线/厘米

Recommended Squeegee推荐刮墨刀

Polyurethane聚氨酯 , durometer硬度

60-74

Printing Equipment Type印刷设备类型

Manual手动

Semi-automatic半自动

High speed高速

Cured adhesion , grade固化后粘附等级

5B

Cured Sheet Resistivity固化后表面电阻率@ 25μm, ohms/sq 

<0.03

 

CURING TIME TABLE  固化进度表

Temperature  温度

Minimum Cure Time  最少固化时间

120°C

15 minutes @

C-EP 522 can be dried immediately after printing at temperatures between 90 to 40ºC. Higher temperatures will yield lower sheet resistance and better mechanical properties. C-EP 522可在90140 ºC下迅速表干,高的温度将导致更低的表面电阻率和更好的机械性能

 

DIRECTIONS FOR USE使用指南

1. thoroughly stirr prior to use. Avoid rapid stirring as this causes air entrapment.使用前充分搅拌,避免剧烈搅拌引入气泡。

2. C-EP 522 is supplied ready for use. Should thinning become necessary, dilute 1 to 3% by weight withdibasic ester. 如有必要,请用二元酯稀释到1-3%的重量比。